| Layer |
1L~20L,
FLEXIBLE PCB (1L~6L), HDI, AL BASE(MCPCB) |
| Material |
CEM-1,
CEM-3, FR-4, High TG, Aluminium Base, Halogen-Free, Polyimide
(FPC) |
| Thickness |
8 ~ 94
mil (0.2 ~ 2.4 mm) |
| Base
Copper Foil |
18 ~ 70
um (H/H ~ 2/2 oz) |
| Min.
Dielectric Thickness |
0.2 mm |
| Inner
Layer Line/Space |
4 / 4 mils
(0.1 / 0.1 mm) |
| Outer
Layer Line/Space |
3 / 3 mils
(0.076 / 0.076 mm) |
| Max.
Panel Size |
21.5กจ
x 24.5กจ |
| Min.
Hole Size |
0.010กจ
(0.25 mm) |
| 0.004กจ
(0.10 mm) for HDI |
| Hole
Size Tolerance |
+/- 1.0
mil (+/- 0.025 mm) |
| Finishing |
HASL (RoHS
- LEAD
FREE), ENTEK, FLASH GOLD, |
| IMM. NI/AU,
IMM. AG, IMM. TIN |
| Gold
Fingers/Tabs (Au thk.) |
Max. 20u"
(0.50 um) hard gold |
| Solder
Mask |
LPI, Peelable
Solder Mask |
| Other
Functional Requirement |
Impediance
(Rigid Board & FPC), Differential Impediance, Carbon Ink |
| Package |
Environmental
friendly vacuum sealed package with desiccant |
| Pearl floss-the
international standard package material fill in the carton box |
| Certification |
UL, ISO9002,
QS9000, ISO14000 & TS16949 |
| Remark |
Negotiate |
