Layer 1L~20L, FLEXIBLE PCB (1L~6L), HDI, AL BASE(MCPCB)
Material CEM-1, CEM-3, FR-4, High TG, Aluminium Base, Halogen-Free, Polyimide (FPC)
Thickness 8 ~ 94 mil (0.2 ~ 2.4 mm)
Base Copper Foil 18 ~ 70 um (H/H ~ 2/2 oz)
Min. Dielectric Thickness 0.2 mm
Inner Layer Line/Space 4 / 4 mils (0.1 / 0.1 mm)
Outer Layer Line/Space 3 / 3 mils (0.076 / 0.076 mm)
Max. Panel Size 21.5กจ x 24.5กจ
Min. Hole Size 0.010กจ (0.25 mm)
0.004กจ (0.10 mm) for HDI
Hole Size Tolerance +/- 1.0 mil (+/- 0.025 mm)
Finishing HASL (RoHS - LEAD FREE), ENTEK, FLASH GOLD,
IMM. NI/AU, IMM. AG, IMM. TIN
Gold Fingers/Tabs (Au thk.) Max. 20u" (0.50 um) hard gold
Solder Mask LPI, Peelable Solder Mask
Other Functional Requirement Impediance (Rigid Board & FPC), Differential Impediance, Carbon Ink
Package Environmental friendly vacuum sealed package with desiccant
Pearl floss-the international standard package material fill in the carton box
Certification UL, ISO9002, QS9000, ISO14000 & TS16949
Remark Negotiate